Xiaojing Liao

6 Patents

• US125502502026

  Package Structure and Electronic Device

  HUAWEI DIGITAL POWER TECHNOLOGIES CO., Ltd.

  0 cites
• US124827242025

  Package Structure and Package System

  Huawei Technologies Co., Ltd.

  0 cites
• US123960932025

  Power Supply Module and Power Device

  Huawei Digital Power Technologies Co., Ltd.

  0 cites
• US123549672025

  Chip Package Assembly, Electronic Device, and Preparation Method of Chip Package Assembly

  HUAWEI TECHNOLOGIES CO., Ltd.

  0 cites
• US122241462025

  Embedded Substrate, Circuit Board Assembly, and Electronic Device

  HUAWEI TECHNOLOGIES CO., Ltd.

  0 cites
• US120755582024

  Printed Circuit Board

  Huawei Digital Power Technologies Co., Ltd.

  0 cites