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Xiaojin Wei
Dublin, CA
US
2 patents
3 Patents
US12174676
2024
Modular Liquid Cooling Architecture for Liquid Cooling
Google LLC
0 cites
US11967538
2024
Three Dimensional IC Package with Thermal Enhancement
Google LLC
0 cites
US11955406
2024
Temperature Control Element Utilized in Device Die Packages
Google LLC
0 cites