Patents/Inventors

Xianmin Tang

San Jose, CAUS37 patents

30 Patents

US125884432026
Methods for Forming Low Resistivity Contacts
Applied Materials Inc.
0 cites
US125819262026
Methods and Apparatus for Processing a Substrate
Applied Materials Inc.
0 cites
US125710922026
Integrated Methods for Graphene Formation
Applied Materials, Inc.
0 cites
US125753922026
Method to Deposit Metal Cap for Interconnect
APPLIED MATERIALS, Inc.
0 cites
US125657022026
Method of Selective Metal Deposition Using Separated Reactant Activation and Plasma Discharging Zone
APPLIED MATERIALS, Inc.
0 cites
US125688042026
Method of In-situ Selective Metal Removal via Gradient Oxidation for Gapfill
Applied Materials, Inc.
0 cites
US125531292026
Electrochemical Reduction of Surface Metal Oxides
Applied Materials, Inc.
0 cites
US125435232026
Chlorine-free Removal of Molybdenum Oxides from Substrates
Applied Materials, Inc.
0 cites
US124630522025
Directional Selective Junction Clean with Field Polymer Protections
Applied Materials, Inc.
0 cites
US124068492025
Methods and Apparatus for Enhancing Selectivity of Titanium and Titanium Silicides During Chemical Vapor Deposition
APPLIED MATERIALS, Inc.
0 cites
US123476952025
Methods for Controlling Contact Resistance in Cobalt-titanium Structures
APPLIED MATERIALS, Inc.
0 cites
US123225732025
Pulsing Plasma Treatment for Film Densification
APPLIED MATERIALS, Inc.
0 cites
US122725512025
Selective Metal Removal with Flowable Polymer
Applied Materials, Inc.
0 cites
US122437742025
Impurity Removal in Doped ALD Tantalum Nitride
Applied Materials, Inc.
0 cites
US122117432025
Method of Forming a Metal Liner for Interconnect Structures
Applied Materials, Inc.
0 cites
US121005762024
Metal Oxide Preclean Chamber with Improved Selectivity and Flow Conductance
APPLIED MATERIALS, Inc.
0 cites
US120946992024
Methods and Apparatus for Controlling Ion Fraction in Physical Vapor Deposition Processes
APPLIED MATERIALS, Inc.
0 cites
US120273542024
Cleaning of SIN with CCP Plasma or RPS Clean
Applied Materials, Inc.
0 cites
US119488362024
Deposition of Metal Films with Tungsten Liner
Applied Materials, Inc.
0 cites
US119396662024
Methods and Apparatus for Precleaning and Treating Wafer Surfaces
APPLIED MATERIALS, Inc.
0 cites
US119159182024
Cleaning of Sin with CCP Plasma or RPS Clean
APPLIED MATERIALS, Inc.
0 cites
US118307282023
Methods for Seamless Gap Filling of Dielectric Material
APPLIED MATERIALS, Inc.
0 cites
US118107702023
Methods and Apparatus for Controlling Ion Fraction in Physical Vapor Deposition Processes
APPLIED MATERIALS, Inc.
0 cites
US118023492023
Method for Depositing High Quality PVD Films
Applied Materials, Inc.
0 cites
US117841272023
Ruthenium Liner and Cap for Back-end-of-line
Applied Materials, Inc.
0 cites
US117768052023
Selective Oxidation and Simplified Pre-clean
APPLIED MATERIALS, Inc.
0 cites
US117641572023
Ruthenium Liner and Cap for Back-end-of-line Applications
Applied Materials, Inc.
0 cites
US115878732023
Binary Metal Liner Layers
Applied Materials, Inc.
0 cites
US115629092023
Directional Selective Junction Clean with Field Polymer Protections
Applied Materials, Inc.
0 cites
US115629252023
Method of Depositing Multilayer Stack Including Copper Over Features of a Device Structure
APPLIED MATERIALS, Inc.
0 cites