Xianlu Cui

3 Patents

• US120837152024

  Mold Compound Dispensing System and Method

  Morgan, Lewis & Bockius LLP

  0 cites
• US118943432024

  Vertical Semiconductor Device with Side Grooves

  Western Digital Technologies, Inc.

  0 cites
• US117569322023

  Sloped Interconnector for Stacked Die Package

  SANDISK TECHNOLOGIES LLC

  0 cites