Xavier Francois Brun

9 Patents

• US125819882026

  Microelectronic Assemblies with Through Die Attach Film Connections

  Intel Corporation

  0 cites
• US125576752026

  Inorganic Redistribution Layer on Organic Substrate in Integrated Circuit Packages

  Intel Corporation

  0 cites
• US125388412026

  Quasi-monolithic Die Architectures

  Intel Corporation

  0 cites
• US124128682025

  Microelectronic Assemblies Including Interconnects with Different Solder Materials

  Intel Corporation

  0 cites
• US123680892025

  Low Cost Embedded Integrated Circuit Dies

  Intel Corporation

  0 cites
• US123477822025

  Microelectronic Assemblies with Direct Attach to Circuit Boards

  Intel Corporation

  0 cites
• US121762922024

  Microelectronic Component Having Molded Regions with Through-mold Vias

  Intel Corporation

  0 cites
• US118173902023

  Microelectronic Component Having Molded Regions with Through-mold Vias

  Intel Corporation

  0 cites
• US116409422023

  Microelectronic Component Having Molded Regions with Through-mold Vias

  Intel Corporation

  0 cites