11 Patents
- 0 cites
- US126045222026Universal Electrically Inactive Devices for Integrated Circuit Packages
Intel Corporation
0 cites - US125327402026Porous Mesh Structures for the Thermal Management of Integrated Circuit Devices
Intel Corporation
0 cites - US124446722025Hybrid Bonding Technologies with Thermal Expansion Compensation Structures
Intel Corporation
0 cites - US123410802025Semiconductor Device Stack-up with Bulk Substrate Material to Mitigate Hot Spots
Intel Corporation
0 cites - US120806202024Additively Manufactured Structures for Heat Dissipation from Integrated Circuit Devices
Intel Corporation
0 cites - 0 cites
- US120210162024Thermally Enhanced Silicon Back End Layers for Improved Thermal Performance
Intel Corporation
0 cites - 0 cites
- US119786892024Semiconductor Device Stack-up with Bulk Substrate Material to Mitigate Hot Spots
Intel Corporation
0 cites - US117568602023Semiconductor Device Stack-up with Bulk Substrate Material to Mitigate Hot Spots
Intel Corporation
0 cites