Woonbae Kim

5 Patents

• US124956332025

  Semiconductor Package Including Stack Structure of Logic Chip and Sensing Chips

  Samsung Electronics Co., Ltd.

  0 cites
• US124186062025

  Electronic Device Comprising Display Module

  Samsung Electronics Co., Ltd.

  0 cites
• US122611812025

  Semiconductor Package Including Image Sensor Chip, Transparent Substrate, and Joining Structure

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US122624962025

  Tray Support Structure and Electronic Device Including the Same

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US115813482023

  Semiconductor Package Including Image Sensor Chip, Transparent Substrate, and Joining Structure

  Samsung Electronics Co., Ltd.

  0 cites