2 Patents
- US121688372024Tin-silver Plating Solution and Method for Forming Tin-silver Solder Bump by Using Same
Dongwoo Fine-chem Co., Ltd.
0 cites - US121216282024Method of Surface Treatment of Titanium Implant Material Using Chloride and Pulse Power and Titanium Implant Produced by the Same
INDUSTRY FOUNDATION OF CHONNAM NATIONAL UNIVERSITY
0 cites