Patents/Inventors

Woon Suk Jung

Ansan-siKR1 patent

2 Patents

US120717032024
Electroplating Solution for Indium-bismuth Alloy for Low-temperature Solder with Improved Bismuth Substitution Prevention Performance
HOJIN PLATECH CO., Ltd.
0 cites
US118791812024
Electroplating Solution of Tin or Tin Alloy with Improved Thickness Variation of Wafer Bumps
HOJIN PLATECH CO., Ltd.
0 cites