Patents/Inventors

Woon-seong Kwon

Santa Clara, CAUS21 patents

21 Patents

US125688342026
Active Silicon D2D Bridge
Google LLC
0 cites
US124762272025
Socket to Support High Performance Multi-die Asics
Google LLC
0 cites
US124701482025
Trans-inductor Voltage Regulator for High Bandwidth Power Delivery
Google LLC
0 cites
US123947562025
Backside Integrated Voltage Regulator for Integrated Circuits
Google LLC
0 cites
US123278172025
ASIC Package with Photonics and Vertical Power Delivery
Google LLC
0 cites
US123158602025
Integrated Circuit Package for High Bandwidth Memory
Google LLC
0 cites
US123085432025
Structure for Optimal XPU Socket Compression
Google LLC
0 cites
US122781602025
Methods and Heat Distribution Devices for Thermal Management of Chip Assemblies
Google LLC
0 cites
US122782172025
Backside Integrated Voltage Regulator for Integrated Circuits
Google LLC
0 cites
US122740792025
Deep Trench Capacitors Embedded in Package Substrate
Google LLC
0 cites
US122438022025
Methods and Heat Distribution Devices for Thermal Management of Chip Assemblies
Google LLC
0 cites
US122389402025
Deep Trench Capacitors Embedded in Package Substrate
Google LLC
0 cites
US120516792024
Backside Interconnection Interface Die for Integrated Circuits Package
Google LLC
0 cites
US119903862024
Methods and Heat Distribution Devices for Thermal Management of Chip Assemblies
Google LLC
0 cites
US119904612024
Integrated Circuit Package for High Bandwidth Memory
Google LLC
0 cites
US119787212024
ASIC Package with Photonics and Vertical Power Delivery
Google LLC
0 cites
US119675382024
Three Dimensional IC Package with Thermal Enhancement
Google LLC
0 cites
US118308552023
Backside Integrated Voltage Regulator for Integrated Circuits
Google LLC
0 cites
US118323962023
Cooling Electronic Devices in a Data Center
Google LLC
0 cites
US117842152023
Deep Trench Capacitors Embedded in Package Substrate
Google LLC
0 cites
US116005482023
Methods and Heat Distribution Devices for Thermal Management of Chip Assemblies
Google LLC
0 cites