26 Patents
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- US125750192026Printed Circuit Board Assembly and Method for Manufacturing Printed Circuit Board Assembly
SAMSUNG SDI CO., Ltd.
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- US124008522025Apparatus for Manufacturing Display Apparatus and Method of Manufacturing Display Apparatus
LTC CO., Ltd
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- US123640072025Integrated Circuit Device Including Insulating Guide Film Between Adjacent Conductive Patterns
Samsung Electronics Co., Ltd.
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- US122437772025Semiconductor Device and Method of Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
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- US121257852024Semiconductor Integrated Circuit Device Suppressing Leakage Current of Multilayer Wiring Structures
SAMSUNG ELECTRONICS CO., Ltd.
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- US120150732024Thin Film Structure Including Dielectric Material Layer and Electronic Device Including the Same
Samsung Electronics Co., Ltd.
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- US118625142024Integrated Circuit Device Including Air Gaps and Method of Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US118238382023Two-dimensional Perovskite Material, Dielectric Material and Multi-layered Capacitor Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US118239522023Semiconductor Device and Method of Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US118239732023Package with Compartmentalized Lid for Heat Spreader and EMI Shield
STATS Chippac Pte. Ltd.
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- US116265802023Manufacturing Method of Display Apparatus Using Laser Irradiation
Samsung Display Co., Ltd.
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