Patents/Inventors

Woo Kyung Sung

Suwon-siKR19 patents

17 Patents

US126146682026
Multilayer Electronic Component with Controlled Sn Diffusion in Internal Electrode
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US125975662026
Multilayer Electronic Component
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US125867292026
Multilayer Electronic Component
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US125371382026
Multilayer Electronic Component
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US124565792025
Multilayer Electronic Component
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US124007942025
Ceramic Electronic Component
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US123744972025
Multilayer Electronic Component with Improved Reliability
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US123548032025
Multilayer Electronic Component Having Structure for Improved Adhesion Force and Moisture Protection
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US123409452025
Multilayer Electronic Component
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US122780562025
Multilayer Electronic Component
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US122550222025
Multilayer Electronic Component Having Insulating Layer Which Includes Fluorine-based Organic Material
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US122494612025
Multilayer Electronic Component
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US122241262025
Multilayer Electronic Component
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US122241272025
Multilayer Electronic Component
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US121128922024
Multilayer Electronic Component
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US119962402024
Electronic Component Having a Body and Sealing Thin Film Disposed in a Microhole of the Body
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US118428532023
Multilayered Electronic Component and Method of Manufacturing the Same
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites