5 Patents
- US124484902025Epoxy Resin Composition for Molding Semiconductor, Molding Film and Semiconductor Package Using the Same
LG CHEM, Ltd.
0 cites - US124046102025Mxene Fibers and Preparation Method Thereof
IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)
0 cites - US123139732025Insulating Layer for Multilayer Printed Circuit Board, Multilayer Printed Circuit Board Comprising Same, and Method for Producing Same
LG CHEM, Ltd.
0 cites - US118114342023Device and Method for Transmitting and Receiving Emulated Wi-fi Packets
KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
0 cites - US117025202023Epoxy Resin Composition for Molding Semiconductor, Molding Film and Semiconductor Package Using the Same
LG CHEM, Ltd.
0 cites