36 Patents
- US123621002025Multilayer Electronic Component for Enhanced Moisture Resistance and Bending Strength
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - US123225572025Electronic Component and Board Having the Same Mounted Thereon
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - US122057722025Multilayer Capacitor and Substrate Including the Same Mounted Thereon
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - US121365232024Multilayer Capacitor and Board Having the Same Mounted Thereon
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - 0 cites
- 0 cites
- US120148802024Multilayered Capacitor and Board Having the Same Mounted Thereon
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - 0 cites
- 0 cites
- US119616822024Multilayer Capacitor and Board Having the Same Mounted Thereon
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - 0 cites
- US118759482024Multilayer Capacitor and Substrate Including the Same Mounted Thereon
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - US118697232024Multilayered Capacitor and Board Having the Same Mounted Thereon
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - US118624042024Multilayer Electronic Component for Enhanced Moisture Resistance and Bending Strength
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - 0 cites
- US118172712023Multilayer Electronic Component Including a Silicon Organic Compound Layer Arranged Between Layers of an External Electrode
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - 0 cites
- 0 cites
- US117840072023Capacitor Component Including Reinforcing Pattern in a Margin/cover Portion
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - US117767532023Multilayer Electronic Component and Board Having the Same Mounted Thereon
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - US117639862023Electronic Component Including Insulating Layer Between Body and Shielding Layer
Samsung Electro-mechanics Co., Ltd.
0 cites - US117421472023Multilayer Ceramic Electronic Component Having Specified Standard Deviation Ratio for Internal Electrode and Dielectric Layer Thicknesses
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - 0 cites
- US116948472023Multilayer Capacitor and Board Having the Same Mounted Thereon
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - 0 cites
- US116825282023Multilayer Capacitor and Board Having the Same Mounted Thereon
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - 0 cites
- US116704592023Multilayer Capacitor and Board Having the Same Mounted Thereon
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - US116579762023Capacitor Component Including Reinforcing Pattern in a Margin/cover Portion
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - 0 cites
- US116369832023Manufacturing Method of Multilayer Ceramic Electronic Component
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - 0 cites
- 0 cites
- US116008412023Separator Assembly for Fuel Cell and Fuel Cell Stack Including Same
Kia Motors Corporation
0 cites - US115943752023Multilayer Capacitor and Substrate Including the Same Mounted Thereon
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - US115690342023Multi-layered Ceramic Electronic Component and Manufacturing Method Thereof
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites