Patents/Inventors

Wonil Lee

Suwon-siKR18 patents

16 Patents

US125885672026
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US125124282025
Semiconductor Device and Method of Fabricating the Same
Samsung Electronics Co., Ltd.
0 cites
US124890712025
Semiconductor Chip and Semiconductor Package Including Bonding Layers Having Alignment Marks
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US124514492025
Semiconductor Package, and Method of Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US124179882025
Interposer, Method for Fabricating the Same, and Semiconductor Package Having the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US124141672025
Method and Device for Communication Between Network Entities in Cloud LAN Environment
Samsung Electronics Co., Ltd.
0 cites
US123983632025
Medium Composition for Botulinum Toxin Production by Culturing of Clostridium Botulinum
JETEMA CO., Ltd.
0 cites
US123107132025
Method of Quantifying Magnetic Resonance Diffusion Parameters by Using Diffusion Weighted Magnetic Resonance Images
Korea Advanced Institute Of Science And Technology
0 cites
US121687902024
Method of Preparing Toxin
JETEMA CO., Ltd.
0 cites
US120876962024
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US120806912024
Semiconductor Devices
Samsung Electronics Co., Ltd.
0 cites
US120587442024
Method and Device for Communication Between Network Entities in Cloud LAN Environment
Samsung Electronics Co., Ltd.
0 cites
US119844152024
Interposer, Method for Fabricating the Same, and Semiconductor Package Having the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US117584542023
Method and Apparatus for Controlling Handover in Wireless Communication System
Samung Electronics Co., Ltd
0 cites
US116533962023
Method and Device for Communication Between Network Entities in Cloud LAN Environment
Samsung Electronics Co., Ltd.
0 cites
US115748732023
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites