9 Patents
- US126108072026Integrated Circuit Devices Including a Back Side Power Distribution Network Structure and Methods of Forming the Same
Samsung Electronics Co., Ltd.
0 cites - US124904912025Integrated Circuit Devices Including a Back Side Power Distribution Network Structure and Methods of Forming the Same
Samsung Electronics Co., Ltd.
0 cites - US124631362025Integrated Circuit Devices Including Backside Power Rail and Methods of Forming the Same
Samsung Electronics Co., Ltd.
0 cites - US123477742025Integrated Circuit Devices Including Metal Lines Spaced Apart from Metal Vias, and Related Fabrication Methods
Samsung Electronics Co., Ltd.
0 cites - US122552482025Semiconductor Device Including Backside Contact Structure Having Positive Slope and Method of Forming Thereof
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US121990382025Semiconductor Devices and Methods of Fabricating the Same
Samsung Electronics Co., Ltd.
0 cites - US121990422025Semiconductor Device Having Interconnection Lines with Different Linewidths and Metal Patterns
Samsung Electronics Co., Ltd
0 cites - US120876692024Integrated Circuit Devices Including Discharging Path and Methods of Forming the Same
Samsung Electronics Co., Ltd.
0 cites - US117282682023Semiconductor Devices Including via Structures Having a via Portion and a Barrier Portion
Samsung Electronics Co., Ltd.
0 cites