4 Patents
- US124380632025Electronic Module Including a Semiconductor Package Disposed on an Interposer Layer
Infineon Technologies Austria AG
0 cites - US119554072024Electronic Module Including a Semiconductor Package Connected to a Fluid Heatsink
Infineon Technologies Austria AG
0 cites - 0 cites
- US115748892023Power Module Comprising Two Substrates and Method of Manufacturing the Same
Infineon Technologies AG
0 cites