Patents/Inventors

Wolfgang Molzer

OttobrunnDE17 patents

6 Patents

US126047592026
Microelectronic Assemblies Including Stiffeners Around Individual Dies
Intel Corporation
0 cites
US125640582026
Packaging Architecture with Reinforcement Structure in Package Substrate
Intel Corporation
0 cites
US125507362026
Packaging Architecture with Reinforcement Structure in Package Substrate
Intel Corporation
0 cites
US125387972026
Substrate for Improved Heat Dissipation and Method
Intel Corporation
0 cites
US124314242025
Buried Power Rails Integrated with Decoupling Capacitance
Intel Corporation
0 cites
US120574112024
Stress Relief Die Implementation
Intel Corporation
0 cites