Patents/Inventors

Wolfgang Lehnert

MiesbachDE7 patents

9 Patents

US125032382025
Fastening Device for Releasable Connection to a Perforated Rail of an Aircraft and Method of Assembly
TELAIR INTERNATIONAL GmbH
0 cites
US124944312025
Power Semiconductor Device and Method of Producing a Power Semiconductor Device
Infineon Technologies AG
0 cites
US124890172025
Method of Manufacturing a Semiconductor Package, Die, and Die Package
Infineon Technologies AG
0 cites
US123639612025
Semiconductor Device
INFINEON TECHNOLOGIES AG
0 cites
US120402882024
Chip Package and Method of Forming a Chip Package
Infineon Technologies AG
0 cites
US118878942024
Methods for Processing a Wide Band Gap Semiconductor Wafer Using a Support Layer and Methods for Forming a Plurality of Thin Wide Band Gap Semiconductor Wafers Using Support Layers
Infineon Technologies AG
0 cites
US117355342023
Chip Package and Method of Forming a Chip Package
Infineon Technologies AG
0 cites
US115575052023
Method of Manufacturing a Template Wafer
Infineon Technologies AG
0 cites
US115575062023
Methods for Processing a Semiconductor Substrate
INFINEON TECHNOLOGIES AG
0 cites