William Stone

3 Patents

• US122180412025

  Integrated Circuit (IC) Packages Employing a Capacitor-embedded, Redistribution Layer (RDL) Substrate for Interfacing an IC Chip(s) to a Package Substrate, and Related Methods

  QUALCOMM INCORPORATED

  0 cites
• US118645372024

  AI Based Feeding System and Method for Land-based Fish Farms

  Reeldata Inc.

  0 cites
• US117841572023

  Package Comprising Integrated Devices Coupled Through a Metallization Layer

  QUALCOMM INCORPORATED

  0 cites