23 Patents
- US125869062026Antenna Package Using Ball Attach Array to Connect Antenna and Base Substrates
Intel Corporation
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- US125754152026Keep Out Zone with Hydrophobic Surface for Integrated Circuit (IC) Package
SK Hynix NAND Product Solutions Corp.
0 cites - US124069622025Power Delivery Through Capacitor-dies in a Multi-layered Microelectronic Assembly
Intel Corporation
0 cites - 0 cites
- US123083622025Packaging Architecture for Disaggregated Integrated Voltage Regulators
Intel Corporation
0 cites - US122887502025Conformal Power Delivery Structure for Direct Chip Attach Architectures
Intel Corporation
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- US122422902025Integrating Voltage Regulators and Passive Circuit Elements with Top Side Power Planes in Stacked Die Architectures
Intel Corporation
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- US121702442024High-throughput Additively Manufactured Power Delivery Vias and Traces
Intel Corporation
0 cites - 0 cites
- US121320152024Package Embedded Magnetic Inductor Structures and Manufacturing Techniques for 5-50 MHZ SMPS Operations
Intel Corporation
0 cites - US120686842024Multi-phase Switching Regulators with Hybrid Inductors and per Phase Frequency Control
Intel Corporation
0 cites - US120027452024High Performance Integrated RF Passives Using Dual Lithography Process
Intel Corporation
0 cites - 0 cites
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- US118701632024Antenna Package Using Ball Attach Array to Connect Antenna and Base Substrates
Intel Corporation
0 cites - 0 cites
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