2 Patents
- US123840812025Mould Half and Mould Method for Transfer Moulding Encapsulating Electronic Components Mounted on a Carrier Including a Dual Support Surface and a Method for Using Such
Besi Netherlands B.V.
0 cites - US118429092023Press, Actuator Set and Method for Encapsulating Electronic Components with at Least Two Individual Controllable Actuators
Besi Netherlands B.V.
0 cites