63 Patents
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- US126157622026Three-dimensional Dynamic Random Access Memory with Stacked Semiconductor Structures
Intel Corporation
0 cites - US126105272026Integrated Circuit Structures Having Memory Access Transistor with Backside Contact
Intel Corporation
0 cites - US126105542026Multi-storage Element Single-transistor Crosspoint Memory Systems at Low Temperatures
Intel Corporation
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- US125754012026Integrated Circuit Devices with Angled Transistors and Angled Routing Tracks
Intel Corporation
0 cites - US125722992026Method and Apparatus to Implement an Integrated Circuit Including Both Dynamic Random-access Memory (DRAM) and Static Random-access Memory (SRAM)
Intel Corporation
0 cites - US125678662026Digital to Analog Converter Using High-injection Velocity Channel Materials for Low Temperature Signal Conversion
Intel Corporation
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- US125637242026Two Transistor Memory Cells with Source-drain Coupling in One Transistor
Intel Corporation
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- US125507332026Multiple Epitaxial Layer Source and Drain Transistors for Low Temperature Computation
Intel Corporation
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- US125503812026Device, Method and System to Provide Epitaxial Structures Opposite Sides of a Separation Layer Between Channel Stacks
Intel Corporation
0 cites - US125435942026Scalable Package Architecture Using Reticle Stitching and Photonics for Integrated Circuits
Intel Corporation
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- US125123652025Integrated Circuit Interconnect Structures with a Metal Chalcogenide Liner
Intel Corporation
0 cites - US125061272025Package Architecture of Photonic System with Vertically Stacked Dies Having Planarized Edges
Intel Corporation
0 cites - US125061282025Package Architecture of Scalable Compute Wall Having Compute Bricks with Vertically Stacked Dies
Intel Corporation
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- US124888322025Embedded Dynamic Random-access Memory (edram) to Operate Based on Data Access Characteristics
INTEL CORPORATION
0 cites - US124713622025Integrated Circuit Structures Having Ultra-high Conductivity Global Routing
Intel Corporation
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- US124713342025Integrated Circuit Devices with Angled Transistors Formed Based on Angled Wafers
Intel Corporation
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- US124069562025Bilayer Memory Stacking with Computer Logic Circuits Shared Between Bottom and Top Memory Layers
Intel Corporation
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- US123275812025Embedded Memory Ic's with Power Supply Droop Circuitry Coupled to Ferroelectric Capacitors
Intel Corporation
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- US121970072025Multi-layered Optical Integrated Circuit Assembly with a Monocrystalline Waveguide and Lower Crystallinity Bonding Layer
Intel Corporation
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- US121702732024Integrated Circuit Assemblies with Direct Chip Attach to Circuit Boards
Intel Corporation
0 cites - US121487472024Gallium Nitride (GAN) Three-dimensional Integrated Circuit Technology
Intel Corporation
0 cites - US121470832024Hybrid Manufacturing for Integrating Photonic and Electronic Components
Intel Corporation
0 cites - US121208652024Arrays of Double-sided Dram Cells Including Capacitors on the Frontside and Backside of a Stacked Transistor Structure
Intel Corporation
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- US119013472024Microelectronic Package with Three-dimensional (3D) Monolithic Memory Die
Intel Corporation
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- US117568862023Hybrid Manufacturing of Microeletronic Assemblies with First and Second Integrated Circuit Structures
Intel Corporation
0 cites - US117496632023Device, Method and System for Providing a Stacked Arrangement of Integrated Circuit Dies
Intel Corporation
0 cites - US116902112023Thin Film Transistor Based Memory Cells on Both Sides of a Layer of Logic Devices
Intel Corporation
0 cites - US116520602023Die Interconnection Scheme for Providing a High Yielding Process for High Performance Microprocessors
Intel Corporation
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