12 Patents
- 0 cites
- US124189882025Inductor-integrating Embedded Support Frame and Substrate, and Manufacturing Method Thereof
Zhuhai ACCESS Semiconductor Co., Ltd.
0 cites - US124128432025Support Frame Structure and Manufacturing Method Thereof
ZHUHAI ACCESS SEMICONDUCTOR CO., Ltd.
0 cites - US124009672025Embedded Packaging Structure and Manufacturing Method Thereof
NANTONG ACCESS SEMICONDUCTOR CO., Ltd.
0 cites - US121486762024Embedded Chip Package and Manufacturing Method Thereof
Zhuhai ACCESS Semiconductor Co., Ltd.
0 cites - US120027342024Circuit Prearranged Heat Dissipation Embedded Packaging Structure and Manufacturing Method Thereof
ZHUHAI ACCESS SEMICONDUCTOR CO., Ltd
0 cites - US119844142024Packaging Structure with Antenna and Manufacturing Method Thereof
ZHUHAI ACCESS SEMICONDUCTOR CO., Ltd
0 cites - US119424652024Embedded Structure, Manufacturing Method Thereof and Substrate
Zhuhai ACCESS Semiconductor Co., Ltd.
0 cites - US118549202023Embedded Chip Package and Manufacturing Method Thereof
Zhuhai ACCESS Semiconductor Co., Ltd.
0 cites - US118221212023Cavity Substrate Having Directional Optoelectronic Transmission Channel and Manufacturing Method Thereof
Zhuhai ACCESS Semiconductor Co., Ltd
0 cites - US115793622023Cavity Substrate Having Directional Optoelectronic Transmission Channel and Manufacturing Method Thereof
Zhuhai ACCESS Semiconductor Co., Ltd
0 cites - US115691772023Support Frame Structure and Manufacturing Method Thereof
ZHUHAI ACCESS SEMICONDUCTOR CO., Ltd
0 cites