Patents/Inventors

Wensen Hung

ZhubeiTW24 patents

19 Patents

US126222742026
Packages with Liquid Metal as Heat-dissipation Media and Method Forming the Same
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US125507752026
Semiconductor Package with Stiffener Structure and Method of Manufacturing the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US125507292026
Heat Spreading Device and Method
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US125388352026
Integrated Chip Package Including a Crack-resistant Lid Structure and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US123879882025
Method of Manufacturing Semiconductor Package Having Lid Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123549272025
Semiconductor Device
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122726122025
Semiconductor Package Module and Manufacturing Methods Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US121702372024
Semiconductor Structure and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US121257572024
Semiconductor Package with Stiffener Structure and Method Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120948362024
Semiconductor Device Having Heat Dissipation Structure of Curved Profile and a Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120741542024
Package Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120210062024
Package Structure and Method and Equipment for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US119617792024
3DIC Packaging with Hot Spot Thermal Management Features
Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC).
0 cites
US119292932024
Semiconductor Package with Lid Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118108332023
Package Structure and Method and Equipment for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US117216022023
Semiconductor Package with Stiffener Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US117156752023
Semiconductor Device and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US115944692023
Semiconductor Device and Method of Manufacture
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY. Ltd.
0 cites
US115878452023
Semiconductor Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites