3 Patents
- US125990252026Chip Packaging Method Involving Fabrication of Wire Bond and Electroplated Metal Bonding Pad Through Formation of Metal Gasket, Passivation Layer, Metal Seed Layer, and Photoresist
HEFEI CHIPMORE TECHNOLOGY CO., Ltd.
0 cites - US123084202025Aluminum-air Composite Battery and Preparation Method
Huadian Water Technology Co. Ltd.
0 cites - US119646792024Underframe End Structure Without Bolster Beam for Rail Vehicle
CRRC Nanjing Puzhen Co., Ltd.
0 cites