7 Patents
- US121855502024Through Array Contact Structure of Three-dimensional Memory Device
YANGTZE MEMORY TECHNOLOGIES CO., Ltd.
0 cites - US121375672024Interconnect Structure of Three-dimensional Memory Device
Yangtze Memory Technologies Co., Ltd.
0 cites - US121375682024Hybrid Bonding Contact Structure of Three-dimensional Memory Device
YANGTZE MEMORY TECHNOLOGIES CO., Ltd.
0 cites - US119569532024Joint Opening Structures of Three-dimensional Memory Devices and Methods for Forming the Same
Yangtze Memory Technologies Co., Ltd.
0 cites - US117857762023Through Array Contact Structure of Three-dimensional Memory Device
Yangtze Memory Technologies Co., Ltd.
0 cites - US117587322023Hybrid Bonding Contact Structure of Three-dimensional Memory Device
Yangtze Memory Technologies Co., Ltd.
0 cites - US115455052023Through Array Contact Structure of Three-dimensional Memory Device
Yangtze Memory Technologies Co., Ltd.
0 cites