Patents/Inventors

Weng Hong Teh

Phoenix, AZUS4 patents

4 Patents

USRE0507962026
Semiconductor Package Having Spacer Layer
Exo Imaging, Inc.
0 cites
US123278072025
High Density Substrate Routing in Package
Intel Corporation
0 cites
US120516672024
High Density Substrate Routing in Package
Intel Corporation
0 cites
US118108842023
High Density Substrate Routing in Package
Intel Corporation
0 cites