17 Patents
- US125754642026Method of Forming Wafer-to-wafer Bonding Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US125687752026Method for Forming a Memory Device at a Backside of a Wafer Substrate, and Memory Cell Including a Memory Device at a Backside of a Wafer Substrate
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US124827852025Trim Free Wafer Bonding Methods and Devices
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US124024052025Integration of Multiple Fin Stuctures on a Single Substrate
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US123962462025Semiconductor Integrated Circuit Including Gate-all-around Fets with Nanosheet Channels and Fin-like Fets
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd
0 cites - US123175422025Semiconductor Device with Backside Self-aligned Power Rail and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US121836782024Backside Power Rail Structure and Methods of Forming Same
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US120627052024Semiconductor Device and Method of Forming Vertical Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US120573852024Integrated Circuits with Backside Power Rails
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US120574772024Semiconductor Structure with Hybrid Nanostructures
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US120403292024Semiconductor Device Structure and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US119730792024Integration of Multiple Fin Structures on a Single Substrate
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US119619152024Capacitance Reduction for Back-side Power Rail Device
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US118429652023Backside Power Rail Structure and Methods of Forming Same
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US117422802023Integrated Circuits with Backside Power Rails
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US116643782023Semiconductor Device Structure and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites