Patents/Inventors

Wen-sung Hsu

Hsinchu CityTW16 patents

17 Patents

US125885222026
Semiconductor Package Structure
MEDIATEK Inc.
0 cites
US125572152026
Semiconductor Package Using Flip-chip Technology
MEDIATEK Inc.
0 cites
US124447152025
Semiconductor Package Structure
MEDIATEK Inc.
0 cites
US123005732025
Semiconductor Device and Manufacturing Method Thereof
MEDIATEK Inc.
0 cites
US121365972024
Semiconductor Package Having an Interposer in Which One or More Dies Are Formed and Method of Forming the Same
MEDIATEK Inc.
0 cites
US120806142024
Lidded Semiconductor Package
MEDIATEK Inc.
0 cites
US120210312024
Semiconductor Package Structure
MEDIATEK Inc.
0 cites
US120210682024
Semiconductor Device with Dummy Thermal Features on Interposer
MEDIATEK Inc.
0 cites
US118547842023
Chip Scale Package Structure and Method of Forming the Same
Mediatek Inc.
0 cites
US118549302023
Semiconductor Chip Package and Fabrication Method Thereof
Mediatek Inc.
0 cites
US118375522023
Semiconductor Package with Layer Structures, Antenna Layer and Electronic Component
Mediatek Inc.
0 cites
US118308512023
Semiconductor Package Structure
Mediatek Inc.
0 cites
US117912662023
Chip Scale Package Structure and Method of Forming the Same
Mediatek Inc.
0 cites
US117425642023
Fan-out Package Structure with Integrated Antenna
Mediatek Inc.
0 cites
US116705962023
Semiconductor Package Structure
MEDIATEK Inc.
0 cites
US116522732023
Innovative Air Gap for Antenna Fan Out Package
Mediatek Inc.
0 cites
US115748812023
Semiconductor Package Structure with Antenna
Mediatek Inc.
0 cites