Patents/Inventors

Wen-jung Tsai

TaichungTW15 patents

15 Patents

US125327452026
Electronic Package and Manufacturing Method Thereof
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
0 cites
US125001312025
Electronic Package Including an Interposer Stacked on an Electronic Element and Manufacturing Method Thereof
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
0 cites
US125001812025
Electronic Package and Manufacturing Method Thereof
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
0 cites
US124762292025
Electronic Package
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
0 cites
US124382662025
Electronic Package and Manufacturing Method Thereof, and Antenna Module and Manufacturing Method Thereof
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
0 cites
US123880622025
Electronic Package and Manufacturing Method Thereof
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
0 cites
US122242552025
Electronic Package Including Lead Frame Having Multiple Conductive Posts
Siliconware Precision Industries Co., Ltd.
0 cites
US122117762025
Electronic Package and Manufacturing Method Thereof
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
0 cites
US121006412024
Electronic Package and Method for Manufacturing the Same
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
0 cites
US120685352024
Electronic Package and Manufacturing Method Thereof, and Antenna Module and Manufacturing Method Thereof
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
0 cites
US120574092024
Electronic Package and Manufacturing Method Thereof
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
0 cites
US119730432024
Multiple Conductive Posts
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
0 cites
US117495832023
Electronic Package and Method for Manufacturing the Same
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
0 cites
US116706072023
Electronic Package
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
0 cites
US115945012023
Fabrication Method of Electronic Package Having Antenna Function
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
0 cites