Patents/Inventors

Wen Hung Huang

KaosiungTW34 patents

30 Patents

US126222802026
Semiconductor Device with Through Package via and Method Therefor
NXP USA, Inc.
0 cites
US125885572026
Multichip Packages with 3D Integration
NXP USA, Inc.
0 cites
US125885382026
Semiconductor Device Having Wired Under Bump Structure and Method Therefor
NXP B.V.
0 cites
US125577092026
Package Structure and Method for Manufacturing the Same
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US125388442026
Double-sided Multichip Packages
NXP USA, Inc.
0 cites
US124944482025
Ubm-free Metal Skeleton Frame with Support Studs and Method for Fabrication Thereof
NXP B.V.
0 cites
US124631412025
Semiconductor Substrate, Semiconductor Package, Method of Manufacturing the Same
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US124069512025
Redistribution Layer Having a Sideview Zig-zag Profile
NXP B.V.
0 cites
US123158202025
Wiring Structure Including Low- and High-density Conductive Structures
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US123157972025
Semiconductor Substrate Structure and Method of Manufacturing the Same
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US123006772025
Semiconductor Device Package Including Stress Buffering Layer
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US122887702025
Semiconductor Packages with Embedded Wiring on Re-distributed Bumps
NXP B.V.
0 cites
US122495852025
Semiconductor Device Package
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US121989982025
Dielectric Sidewall Protection and Sealing for Semiconductor Devices in a in Wafer Level Packaging Process
NXP B.V.
0 cites
US121007372024
Nanowire Stack GAA Device with Selectable Numbers of Channel Strips
National Taiwan University
0 cites
US120806012024
Packaged Semiconductor Devices and Methods Therefor
NXP B.V.
0 cites
US120210442024
Semiconductor Device Package and Method of Manufacturing the Same
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US119617992024
Semiconductor Substrate Structure and Method of Manufacturing the Same
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US119357532024
Backside and Sidewall Metallization of Semiconductor Devices
NXP B.V
0 cites
US119232742024
Semiconductor Device Package Including Promoters and Method of Manufacturing the Same
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US119088152024
Semiconductor Device Package
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US118942932024
Circuit Structure and Electronic Structure
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US118879432024
Semiconductor Devices, Semiconductor Device Packages and Method for Manufacturing the Same
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US118482802023
Method for Manufacturing Assembly Structure by Using Frame Structure on Substrate
ADVANCED Semlconductor ENGINEERING, Inc.
0 cites
US117912932023
Semiconductor Device and Method of Manufacturing the Same
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US117423882023
Nanowire Stack GAA Device with Selectable Numbers of Channel Strips
National Taiwan University
0 cites
US117282602023
Wiring Structure and Method for Manufacturing the Same
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US117216342023
Conductive Structure and Wiring Structure Including the Same
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US117216782023
Semiconductor Device Package Including Stress Buffering Layer
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US116409472023
Pre-resist Island Forming via Method and Apparatus
NXP B.V.
0 cites