4 Patents
- US125990452026Sensor Chips Having Columnar Microstructures Embedded and Surrounded by Adhesive Layer in a Package Structure and Manufacturing Method Thereof
TONG HSING ELECTRONIC INDUSTRIES, Ltd.
0 cites - 0 cites
- US125504632026Sensor Package Structure and Sensing Module Thereof
TONG HSING ELECTRONIC INDUSTRIES, Ltd.
0 cites - 0 cites