Patents/Inventors

Wen-chen Hsieh

Taichung CityTW3 patents

3 Patents

US125936942026
Electronic Package and Substrate Structure Thereof
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
0 cites
US122781732025
Electronic Package and Substrate Structure Thereof
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
0 cites
US121548482024
Electronic Package and Manufacturing Method Thereof, and Substrate Structure
Siliconware Precision Industries Co., Ltd.
0 cites