11 Patents
- US125507272026Elastic Heat Spreader for Chip Package, Package Structure and Packaging Method
STATS CHIPPAC SEMICONDUCTOR (JIANGYIN) CO., Ltd.
0 cites - US125435182026Vapor Deposition of Tellurium Nanomesh Electronics on Arbitrary Surfaces at Low Temperature
City University Of Hong Kong
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- US119738242024Method for Data Transmission of Audio and Video in End-to-end System
SHANGHAI ANVIZ TECHNOLOGY CO., Ltd.
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