Patents/Inventors

Weihua Tang

Chandler, AZUS10 patents

11 Patents

US124827792025
Hybrid Backside Thermal Structures for Enhanced Ic Packages
Intel Corporation
0 cites
US123410802025
Semiconductor Device Stack-up with Bulk Substrate Material to Mitigate Hot Spots
Intel Corporation
0 cites
US120210162024
Thermally Enhanced Silicon Back End Layers for Improved Thermal Performance
Intel Corporation
0 cites
US119786892024
Semiconductor Device Stack-up with Bulk Substrate Material to Mitigate Hot Spots
Intel Corporation
0 cites
US119489062024
Hybrid Backside Thermal Structures for Enhanced IC Packages
Intel Corporation
0 cites
US117568562023
Package Architecture Including Thermoelectric Cooler Structures
Intel Corporation
0 cites
US117568602023
Semiconductor Device Stack-up with Bulk Substrate Material to Mitigate Hot Spots
Intel Corporation
0 cites
US116768832023
Thermoelectric Coolers Combined with Phase-change Material in Integrated Circuit Packages
Intel Corporation
0 cites
US116642942023
Phase Change Materials for Electromagnetic Interference Shielding and Heat Dissipation in Integrated Circuit Assemblies
Intel Corporation
0 cites
US116263952023
Thermal Spreading Management of 3D Stacked Integrated Circuits
Intel Corporation
0 cites
US115748512023
Coupled Cooling Fins in Ultra-small Systems
Intel Corporation
0 cites