Patents/Inventors

Wei-shun Wang

Palo Alto, CAUS3 patents

4 Patents

US124944532025
Package-on-package Assembly with Wire Bonds to Encapsulation Surface
Adeia Semiconductor Solutions LLC
0 cites
US122118212025
Package-on-package Assembly with Wire Bond Vias
Adeia Semiconductor Technologies LLC
0 cites
US118308452023
Package-on-package Assembly with Wire Bonds to Encapsulation Surface
TESSERA LLC
0 cites
US117355632023
Package-on-package Assembly with Wire Bond Vias
Invensas LLC
0 cites