Patents/Inventors

Wei-sheng Lei

San Jose, CAUS11 patents

11 Patents

US123880492025
High Connectivity Device Stacking
Applied Materials, Inc.
0 cites
US123746782025
Lithium Metal Surface Modification Using Carbonate Passivation
Elevated Materials US LLC
0 cites
US123580732025
Method and Apparatus for Laser Drilling Blind Vias
Applied Materials, Inc.
0 cites
US121319522024
Wafer Dicing Using Femtosecond-based Laser and Plasma Etch
Applied Materials, Inc.
0 cites
US120913492024
Laser Dicing Glass Wafers Using Advanced Laser Sources
Applied Materials, Inc.
0 cites
US119643432024
Laser Dicing System for Filamenting and Singulating Optical Devices
Applied Materials, Inc.
0 cites
US118548882023
Laser Scribing Trench Opening Control in Wafer Dicing Using Hybrid Laser Scribing and Plasma Etch Approach
Applied Materials, Inc.
0 cites
US117423302023
High Connectivity Device Stacking
Applied Materials, Inc.
0 cites
US117053652023
Methods of Micro-via Formation for Advanced Packaging
Applied Materials, Inc.
0 cites
US116768322023
Laser Ablation System for Package Fabrication
Applied Materials, Inc.
0 cites
US116211942023
Wafer Dicing Using Femtosecond-based Laser and Plasma Etch
Applied Materials, Inc.
0 cites