Patents/Inventors

Wei-lun K. Jen

Chandler, AZUS5 patents

6 Patents

US123277732025
Package with Underfill Containment Barrier
Intel Corporation
0 cites
US120681722024
Sacrificial Pads to Prevent Galvanic Corrosion of FLI Bumps in EMIB Packages
Intel Corporation
0 cites
US119358052024
Package with Underfill Containment Barrier
Intel Corporation
0 cites
US116642902023
Package with Underfill Containment Barrier
Intel Corporation
0 cites
US115812712023
Methods to Pattern TFC and Incorporation in the ODI Architecture and in Any Build Up Layer of Organic Substrate
Intel Corporation
0 cites
US115520192023
Substrate Patch Reconstitution Options
Intel Corporation
0 cites