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Wei-lun Jen
Chandler, AZ
US
4 patents
4 Patents
US12336196
2025
Magnetic Core Inductors on Package Substrates
Intel Corporation
0 cites
US11923307
2024
Microelectronic Structures Including Bridges
Intel Corporation
0 cites
US11769719
2023
Dual Trace Thickness for Single Layer Routing
Intel Corporation
0 cites
US11764150
2023
Inductors for Package Substrates
Intel Corporation
0 cites