Patents/Inventors

Wei-jhih Mao

TaipeiTW7 patents

8 Patents

US124972852025
Stopper Bump Structures for MEMS Device
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US124128632025
Die Attached Leveling Control by Metal Stopper Bumps
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123587832025
Wire-bond Damper for Shock Absorption
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123227222025
Die Attached Leveling Control by Metal Stopper Bumps
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US119935102024
Composite Spring Structure to Reinforce Mechanical Robustness of a MEMS Device
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US119874942024
Wire-bond Damper for Shock Absorption
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US119233312024
Die Attached Leveling Control by Metal Stopper Bumps
0 cites
US116613332023
Semiconductor Structure and Manufacturing Method Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites