Patents/Inventors

Wei-jen Wu

New TaipeiTW3 patents

4 Patents

US124069702025
Semiconductor Package and Method of Bonding Workpieces
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123811912025
Semiconductor Package, Method of Bonding Workpieces and Method of Manufacturing Semiconductor Package
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123373482025
Ultrasonic Transducer
Unictron Technologies Corporation
0 cites
US119088432024
Semiconductor Package, Method of Bonding Workpieces and Method of Manufacturing Semiconductor Package
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites