Wei Fen Sueann Lim

5 Patents

• US120210112024

  Solder Surface Features for Integrated Circuit Packages

  TEXAS INSTRUMENTS INCORPORATED

  0 cites
• US117911702023

  Universal Semiconductor Package Molds

  TEXAS INSTRUMENTS INCORPORATED

  0 cites
• US117422632023

  Flippable Leadframe for Packaged Electronic System Having Vertically Stacked Chip and Components

  Texas Instruments Incorporated

  0 cites
• US116263502023

  Cutting a Leadframe Assembly with a Plurality of Punching Tools

  TEXAS INSTRUMENTS INCORPORATED

  0 cites
• US115691522023

  Electronic Device with Lead Pitch Gap

  TEXAS INSTRUMENTS INCORPORATED

  0 cites