48 Patents
- US126108132026Interconnect Structure Including Charged Dielectric Layers
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US125486192026Device and Circuit with Voltage Suppression
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - 0 cites
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- US125060872025Semiconductor Package with Redistribution Structure and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US125074712025Semiconductor Device and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - 0 cites
- US124395942025Semiconductor Device and Manufacturing Method Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - 0 cites
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- US123746582025Bonded Wafer Device Structure and Methods for Making the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites - US123278192025Devices Employing Thermal and Mechanical Enhanced Layers and Methods of Forming Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US123227262025Method of Forming an Integrated Circuit Package Having a Padding Layer on a Carrier
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
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- US122551332025Electrical Fuse (e-fuse) One-time Programmable (OTP) Device and Manufacturing Method Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US122242472025Fan-out Package Having a Main Die and a Dummy Die
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US122179752025Semiconductor Device Having Metal Gate and Poly Gate
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US122056342025Electronic Circuits, Memory Devices, and Methods for Operating an Electronic Circuit
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites - US121912242025Semiconductor Package and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US121912392025Stacked via Structure Disposed on a Conductive Pillar of a Semiconductor Die
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US121760262024Static Random Access Memory with a Supplementary Driver Circuit and Method of Controlling the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US121762992024Semiconductor Device and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US121273992024Array Boundary Structure to Reduce Dishing
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US121070012024Semiconductor Feature and Method for Manufacturing the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US119787402024Semiconductor-on-insulator (SOI) Semiconductor Structures Including a High-k Dielectric Layer and Methods of Manufacturing the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites - US119675632024Fan-out Package Having a Main Die and a Dummy Die
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US119554392024Semiconductor Package with Redistribution Structure and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
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- US118548282023Semiconductor Device Having Metal Gate and Poly Gate
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US118550182023Semiconductor Device and Method of Manufacture
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US117641032023Semiconductor Feature and Method for Manufacturing the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US117568702023Stacked via Structure Disposed on a Conductive Pillar of a Semiconductor Die
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US117423482023Semiconductor Device and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US117069142023Method of Forming an Array Boundary Structure to Reduce Dishing
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US116825932023Interposer Test Structures and Methods
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US116766602023Static Random Access Memory with a Supplementary Driver Circuit and Method of Controlling the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US116643222023Multi-stacked Package-on-package Structures
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US116520632023Semiconductor Package and Method of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - 0 cites
- US116120572023Opening in the Pad for Bonding Integrated Passive Device in Info Package
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US116006182023Integrated Circuit Structure and Manufacturing Method Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US115878872023Semiconductor Device and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US115812682023Semiconductor Package with Redistribution Structure and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
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