Patents/Inventors

Wai Ling Lee

Bayan LepasMY2 patents

3 Patents

US121129972024
Micro Through-silicon via for Transistor Density Scaling
Intel Corporation
0 cites
US120806282024
Micro Through-silicon via for Transistor Density Scaling
Intel Corporation
0 cites
US116520262023
Micro Through-silicon via for Transistor Density Scaling
Intel Corporation
0 cites