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Inventors
Wai Leung William Cheng
Hong Kong
CN
1 patent
2 Patents
US11918311
2024
Robotic Devices and Systems for Performing Single Incision Procedures and Natural Orifice Translumenal Endoscopic Surgical Procedures, and Methods of Configuring Robotic Devices and Systems
IEMIS (HK) Limited
0 cites
US11690647
2023
Surgical Arm System with Internally Drive Gear Assemblies
BIO-MEDICAL ENGINEERING (HK) LIMITED
0 cites