Patents/Inventors

Wai Hoe Lee

SingaporeSG2 patents

3 Patents

US121836202024
Apparatus and Method for Bonding a Plurality of Dies to a Carrier Panel
PYXIS CF PTE. Ltd.
0 cites
US118173262023
Precision Reconstruction for Panel-level Packaging
PYXIS CF PTE. Ltd.
0 cites
US115520432023
Post Bond Inspection of Devices for Panel Packaging
PYXIS CF PTE. Ltd.
0 cites