Patents/Inventors

Wagno Alves Braganca, Jr.

IncheonKR5 patents

6 Patents

US121070282024
Thermally Enhanced FCBGA Package
STATS Chippac Pte. Ltd.
0 cites
US120741352024
Semiconductor Device and Method of Controlling Warpage During LAB
STATS Chippac Pte. Ltd.
0 cites
US119293342024
Die-beam Alignment for Laser-assisted Bonding
STATS Chippac Pte. Ltd.
0 cites
US118173572023
Region-of-interest Positioning for Laser-assisted Bonding
STATS Chippac Pte. Ltd.
0 cites
US116887182023
Semiconductor Device and Method of Controlling Warpage During LAB
STATS Chippac Pte. Ltd.
0 cites
US116705632023
Thermally Enhanced FCBGA Package
STATS Chippac Pte. Ltd.
0 cites