12 Patents
- US126222792026Package with Dual Layer Routing Including Ground Return Path
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- US124128402025Power Module with Multi-layer Substrate and Second Insulation Layer to Increase Power Density
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- US121365882024Heat Slug Attached to a Die Pad for Semiconductor Package
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0 cites - US121257992024Embedded Die Packaging with Integrated Ceramic Substrate
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- US118698392024Package Panel Processing with Integrated Ceramic Isolation
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- US117156792023Power Stage Package Including Flexible Circuit and Stacked Die
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