Patents/Inventors

Vishnu Prasad

MunichDE7 patents

3 Patents

US126223192026
Stacked Die Packaging Architecture with Conductive Vias on Interposer
Intel Corporation
0 cites
US122495532025
Thermal Contacts at Periphery of Integrated Circuit Packages
Intel Corporation
0 cites
US117980372023
Methods and Systems for Creating Audience Segments
Customerlabs, Inc.
0 cites